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Large, sculpted parts can be molded economically. Variable thickness walls allow for greater design freedom. Closed molds produce accurately molded and structurally strong parts. Lower tooling cost and shorter tooling lead time. A wide variety of material properties including UL94VO. Electronic components can be encapsulated. RIM parts are lower cost than the same parts made from metal or fiberglass. Composites - RIM parts can be reinforced with many materials.
Exothermic CapabilitiesCAD Engineering Review RIM Molding Design RIM Molding Manufacture RIM Molding Repair/Modification RIM Molding Precision Painting Silk Screening Assembly |
Reaction Injection Molding Chosen for Encapsulation of Complex Metal Assembly and Printed Circuit BoardKendro Laboratory Products is a global leader in products and services for the life science, material science, drug discovery, and bioprocessing markets. Kendro manufactures and markets a wide variety of equipment for the pharmaceutical, biotechnology, clinical, diagnostic, and blood processing sectors. When Kendro was developing a new high speed centrifuge, which featured the encapsulation of a complex metal assembly into one molded part and the encapsulation of sophisticated electronics, they turned to Exothermic Molding and Reaction Injection Molding technology to produce it. The centrifuge cover had to withstand destructive burst tests to ensure operator safety, as well as provide a thermal barrier necessary in technical centrifuge applications. To achieve these goals, a 1/4" Aluminum Plate (6061T6) with an 1100 "O" Series hydro-formed aluminum shell spot welded to the plate, along with a steel alloy strap, needed to be encapsulated into a single mold part. Reaction Injection Molding's low temperature, low pressure, highly adhesive process allows encapsulation of metal plates without any deformation. It also provides many cosmetic advantages. Variable wall thickness of .062" - 1", produced from high density self skinning foam, allows for design freedoms. Low cost, fabricated aluminum molds were used. Finishing included painting and threaded brass inserts. Another part for the centrifuge, the ID Sensor, required the encapsulation of a printed circuit board to protect sensitive electronics and guard proprietary design information. Because exposure to heat and pressure can damage printed circuit boards, the Reaction Injection Molding process is perfect for their safe encapsulation. The mold for this part required "soft" parts allowing the wires attached to the printed circuit board to come out of the encapsulation. Along with achieving design goals, the encapsulated parts had the added advantage of parts consolidation, reducing the complexity of purchasing, receiving, inspection and warehousing. |
Centrifuge Cover Cross Sections
ID Sensor Cross Section |
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Large, lightweight RIM parts |
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EXOTHERMIC MOLDING INC. |
Reaction Injection Molding |
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