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Advantages of using RIM and its quick turnaround.
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Application Case Studies
The capabilities of RIM Molding offer greater freedom to create complex surfaces and add features to parts while keeping tooling costs low. Specifically, the RIM Molding process is beneficial in applications requiring:
Large Molded Parts
Large molds can be filled due to the low viscosity of the RIM process’ liquid polyurethane components. The size of the part that can be molded depends on the speed of the reactivity profile of the polyurethane formulation and the throughput of the metering unit (the pounds per minute that can be dispensed). Unlike thermoplastics, where a molten plastic is compacted in a mold and then solidifies upon cooling, RIM systems use two liquids that chemically react to form a plastic material. RIM mold pressures are significantly lower than thermoplastic mold pressures, which permits large parts to be molded with modest sized presses.
CASE STUDY: Major Bank Uses Reaction Injection Molding Parts in Branch Re-Branding Effort
Application Examples:
Point-of-Sale Display
Equipment Hood
Wall-Thickness Variation
The RIM process gives the designer the flexibility to produce parts with significant wall thickness variations - typically from .125" to 1.125" in the same part. CASE STUDY: RIM Enables Complex Design Geometries in Medical System Enclosure Panels Application Examples:
Complex Assembly
Incubator Base
Encapsulation
Since the Reaction Injection Molding process uses low viscosity liquids with low temperatures and pressures, a wide variety of other materials can be incorporated (encapsulated) into the molded part. For example, electronic circuit boards can be encapsulated in polyurethane to protect the circuit from moisture and other environmental hazards. CASE STUDY: RIM Chosen for Encapsulation of Complex Metal
Assembly and Printed Circuit Board
Application Examples:
Encapsulated Centrifuge Cover and Electronic Component
Chemical Resistance
Polyurethane tolerates many harsh chemical environments and can be formulated to withstand specific chemicals. As with all plastics, it is important to identify the chemicals the part may be exposed to during processing and assembly, as well as in end use. CASE STUDY: MSDS & Solvent Study
Since the Reaction Injection Molding process uses low viscosity liquids with low temperatures and pressures, a wide variety of other materials can be incorporated (encapsulated) into the molded part. For example, electronic circuit boards can be encapsulated in polyurethane to protect the circuit from moisture and other environmental hazards.